Introducing our newly shipped PCB made of RO306 substrates.
RO3006 Introduction:
Rogers RO3006 laminates are advanced circuit materials that utilize ceramic-filled PTFE composites. These materials are specifically designed to offer exceptional stability in both electrical and mechanical properties. One notable feature of RO3006 is its ability to maintain a stable dielectric constant (Dk) over a wide temperature range. This characteristic eliminates the step change in Dk that is commonly observed in PTFE glass materials near room temperature.
Features:
RO3006 laminates from Rogers consist of ceramic-filled PTFE composites. These materials exhibit a dielectric constant of 6.15 +/- 0.15 at 10 GHz and 23°C, along with a low dissipation factor of 0.002 at the same frequency and temperature. With a high thermal decomposition temperature exceeding 500°C, RO3006 demonstrates excellent thermal stability. It also offers a thermal conductivity of 0.79 W/mK, facilitating efficient heat transfer. In terms of moisture absorption, RO3006 boasts a low rate of 0.02%. Additionally, the material's coefficient of thermal expansion ranges from 17 ppm/°C to 24 ppm/°C (-55 to 288 °C) in the X, Y, and Z axes.
Benefits:
RO3006 laminates provide uniform mechanical properties across a range of dielectric constants, making them ideal for multi-layer board designs that require different dielectric constants. These laminates are also compatible with hybrid designs that involve epoxy glass multi-layer boards. Another advantage of RO3006 is its low in-plane expansion coefficient, which matches that of copper. This characteristic enhances the reliability of surface-mounted assemblies and makes it suitable for applications sensitive to temperature changes. Furthermore, RO3006 exhibits excellent dimensional stability. The volume manufacturing process used for these laminates ensures economical pricing, making them a cost-effective choice.
| RO3006 Typical Value |
| Property | RO3006 | Direction | Units | Condition | Test Method |
| Dielectric Constant,εProcess | 6.15±0.05 | Z | | 10 GHz/23℃ | IPC-TM-650 2.5.5.5 Clamped Stripline |
| Dielectric Constant,εDesign | 6.5 | Z | | 8GHz to 40 GHz | Differential Phase Length Method |
| Dissipation Factor,tanδ | 0.002 | Z | | 10 GHz/23℃ | IPC-TM-650 2.5.5.5 |
| Thermal Coefficient of ε | -262 | Z | ppm/℃ | 10 GHz -50℃to 150℃ | IPC-TM-650 2.5.5.5 |
| Dimensional Stability | 0.27
0.15 | X
Y | mm/m | COND A | IPC-TM-650 2.2.4 |
| Volume Resistivity | 105 | | MΩ.cm | COND A | IPC 2.5.17.1 |
| Surface Resistivity | 105 | | MΩ | COND A | IPC 2.5.17.1 |
| Tensile Modulus | 1498
1293 | X
Y | MPa | 23℃ | ASTM D 638 |
| Moisture Absorption | 0.02 | | % | D48/50 | IPC-TM-650 2.6.2.1 |
| Specific Heat | 0.86 | | j/g/k | | Calculated |
| Thermal Conductivity | 0.79 | | W/M/K | 50℃ | ASTM D 5470 |
Coefficient of Thermal Expansion
(-55 to 288℃) | 17
17
24 | X
Y
Z | ppm/℃ | 23℃/50% RH | IPC-TM-650 2.4.4.1 |
| Td | 500 | | ℃ TGA | | ASTM D 3850 |
| Density | 2.6 | | gm/cm3 | 23℃ | ASTM D 792 |
| Copper Peel Stength | 7.1 | | Ib/in. | 1oz,EDC After Solder Float | IPC-TM 2.4.8 |
| Flammability | V-0 | | | | UL 94 |
| Lead-free Process Compatible | Yes | | | | |
PCB Stackup and Construction Details:
For this 2-layer rigid PCB, the stackup consists of a copper layer with a thickness of 35 μm, followed by the RO3006 substrate with a thickness of 25mil (0.635mm), and another copper layer with a thickness of 35 μm.
The PCB construction details include a board size of 30mm x 37mm for a single piece. The minimum trace/space is 5/5 mils, and the minimum hole size is 0.25mm. There are no blind vias in this configuration. The finished board thickness is 0.8mm, and the outer copper layers have a weight of 1 oz (1.4 mils). The via plating thickness is 20 μm. The surface finish is immersion gold, and the top silkscreen is white, while no silkscreen is applied to the bottom. Additionally, no solder mask is present on the top or bottom layers. Prior to shipment, a 100% electrical test is conducted to ensure quality.
PCB Statistics:
In terms of PCB statistics, this configuration includes 15 components and a total of 50 pads. Out of these pads, 31 are through-hole pads, while 19 are top surface-mount technology (SMT) pads. There are no bottom SMT pads. This PCB design incorporates 38 vias and consists of 2 nets.
Artwork and Standards:
The supplied artwork type for this PCB design is Gerber RS-274-X, a widely accepted industry standard. The accepted standard for this design is IPC-Class-2, ensuring compliance with quality and performance requirements.
Availability and Typical Applications:
RO3006 laminates are available worldwide, providing accessibility for various markets. These laminates find application in several industries. They are particularly suitable for automotive radar applications, global positioning satellite antennas, cellular telecommunications systems (including power amplifiers and antennas), patch antennas for wireless communications, direct broadcast satellites, cable systems for data link, remote meter readers, and power backplanes. Their exceptional electrical and mechanical properties make them versatile and reliable for a wide range of applications.
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2L RO3006 RF PCB 1oz Copper White Silkscreen With ENIG Images
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