The Rogers RO3210 High Frequency PCB is engineered for superior electrical performance and mechanical stability, making it the go-to solution for complex, high-frequency applications. Utilizing ceramic-filled laminates reinforced with woven fiberglass, this PCB combines the benefits of rigidity and surface smoothness, ensuring reliability in demanding environments.
Key Features
Dielectric Constant (Dk): 10.2 ± 0.5
Dissipation Factor: 0.0027 at 10 GHz
Coefficient of Thermal Expansion: Matched to copper (x: 13 ppm/°C, y: 13 ppm/°C, z: 34 ppm/°C)
Decomposition Temperature (Td): 500 °C (TGA)
Thermal Conductivity: 0.81 W/mk
Flammability Rating: V0 per UL 94 standard
Benefits
Enhanced Rigidity: Woven glass reinforcement facilitates easier handling and assembly.
Uniform Performance: Provides consistent electrical and mechanical properties across complex designs.
Low In-Plane Expansion: The matched expansion coefficient ensures compatibility with epoxy multi-layer boards and reliable surface-mounted assemblies.
Excellent Dimensional Stability: Guarantees high production yields and minimizes defects.
Surface Smoothness: Enables finer line etching tolerances for intricate designs.
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| Property | RO3210 | Direction | Units | Condition | Test Method |
| Dielectric Constant,εProcess | 10.2±0.5 | Z | | 10 GHz 23℃ | IPC-TM-650 2.5.5.5 Clamped Stripline |
| Dielectric Constant,εDesign | 10.8 | Z | | 8GHz to 40 GHz | Differential Phase Length Method |
| Dissipation Factor,tanδ | 0.0027 | Z | | 10 GHz 23℃ | IPC-TM-650 2.5.5.5 |
| Thermal Coefficient of ε | -459 | Z | ppm/℃ | 10 GHz 0℃to 100℃ | IPC-TM-650 2.5.5.5 |
| Dimensional Stability | 0.8 | X, Y | mm/m | COND A | ASTM D257 |
| Volume Resistivity | 103 | | MΩ.cm | COND A | IPC 2.5.17.1 |
| Surface Resistivity | 103 | | MΩ | COND A | IPC 2.5.17.1 |
| Tensile Modulus | 579
517 | MD
CMD | kpsi | 23℃ | ASTM D 638 |
| Water Absorption | ＜0.1 | - | % | D24/23 | IPC-TM-650 2.6.2.1 |
| Specific Heat | 0.79 | | j/g/k | | Calculated |
| Thermal Conductivity | 0.81 | | W/M/K | 80℃ | ASTM C518 |
Coefficient of Thermal Expansion
(-55 to 288℃) | 13
34
| X,Y
Z | ppm/℃ | 23℃/50% RH | IPC-TM-650 2.4.4.1 |
| Td | 500 | | ℃ | TGA | ASTM D3850 |
| Density | 3 | | gm/cm3 | | |
| Copper Peel Stength | 11 | | pli | 1oz,EDC After Solder Float | IPC-TM 2.4.8 |
| Flammability | V-0 | | | | UL 94 |
| Lead-free Process Compatible | Yes | | | | |
This PCB features a 2-layer rigid stackup, with a copper layer thickness of 35 μm on both sides and a 0.762 mm (30 mil) Rogers RO3210 core. The board dimensions measure 120 mm x 80 mm (± 0.15 mm), with a finished board thickness of 0.8 mm. The minimum trace and space are set at 5/5 mils, with a minimum hole size of 0.3 mm. The finished copper weight is 1 oz (1.4 mils) on the outer layers, and the via plating thickness is 20 μm. This PCB is finished with immersion silver, providing excellent solderability.
The artwork for this PCB is provided in Gerber RS-274-X format, ensuring compatibility with industry standards. Each PCB adheres to IPC-Class-2 quality standards and undergoes 100% electrical testing prior to shipment, guaranteeing reliability and performance.
Applications
The Rogers RO3210 PCB is versatile and suitable for a wide range of applications, including:
Automotive collision avoidance systems
Global positioning satellite antennas
Wireless telecommunications systems
Microstrip patch antennas
Direct broadcast satellites
Datalink on cable systems
Remote meter readers
Power backplanes
LMDS and wireless broadband
Base station infrastructure
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RO3210 30mil 2 Layer Immersion Silver Rogers Pcb Circuits Images
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