The RF-35 PCB is a cutting-edge organic-ceramic laminate from Taconic’s ORCER family, specifically tailored for commercial microwave and radio frequency applications. Utilizing woven glass reinforcement, RF-35 leverages Taconic's expertise in ceramic fill technology and coated PTFE fiberglass, making it an excellent choice for low-cost, high-volume production.
RF-35 is distinguished by its superior peel strength for both 1/2 ounce and 1 ounce copper, which is essential for rework situations. Additionally, its ultra-low moisture absorption rate and low dissipation factor significantly minimize phase shifts with frequency, ensuring reliable performance.
Key Features
Dielectric Constant: 3.5 at 1.9 GHz, providing high signal integrity.
Dissipation Factor: Exceptionally low at 0.0018 at 1.9 GHz, reducing energy loss.
Dielectric Breakdown Strength: 41 kV, offering robust insulation.
Coefficient of Thermal Expansion (CTE): X CTE of 19 ppm/°C, Y CTE of 24 ppm/°C, Z CTE of 64 ppm/°C, ensuring stability across temperature variations.
Flammability Rating: UL-94 V0, indicating compliance with safety standards.
| Property | Test Method | Unit | Value | Unit | Value |
| Dielectric Constant @ 1.9 GHz | IPC-TM 650 2.5.5 | | 3.5 | | 3.5 |
| Dissipation Factor @ 1.9 GHz | IPC-TM 650 2.5.5 | | 0.0018 | | 0.0018 |
| Moisture Absorption (.060") | IPC-TM 650 2.6.2.1 | % | 0.02 | % | 0.02 |
| Peel Strength (1/2 oz. copper) | IPC-TM 650 2.4.8 | lbs./linear inch | >8.0 | N/mm | >1.5 |
| Peel Strength (1 oz. copper) | IPC-TM 650 2.4.8 | lbs./linear inch | >10.0 | N/mm | >1.8 |
| Dielectric Breakdown | IPC-TM 650 2.5.6 | kV | 41 | kV | 41 |
| Volume Resistivity | IPC-TM 650 2.5.17.1 | Mohm/cm | 1.26 x 109 | Mohm/cm | 1.26 x 109 |
| Surface Resistivity | IPC-TM 650 2.5.17.1 | Mohm | 1.46 x 108 | Mohm | 1.46 x 108 |
| Arc Resistance | IPC TM 650 2.5.1 | seconds | >180 | seconds | >180 |
| Flexural Strength Lengthwise | ASTM D 790 | psi | >22,000 | N/mm2 | >152 |
| Flexural Strength Crosswise | ASTM D 790 | psi | >18,000 | N/mm2 | >124 |
| Thermal Conductivity | ASTM F 433 | W/m/K | 0.24 | W/m/K | 0.24 |
| Tensile Strength Lengthwise | ASTM D 638 | psi | 27,000 | N/mm2 | 187 |
| Tensile Strength Crosswise | ASTM D 638 | psi | 21,000 | N/mm2 | 145 |
| Dimensional Stability Lengthwise | IPC-TM 650 2.4.39 | in/in | 0.00004 | mm/mm | 0.00004 |
| Dimensional Stability Crosswise | IPC-TM 650 2.4.39 | in/in | -0.0001 | mm/mm | -0.0001 |
| x-y CTE | ASTM D 3386 (TMA) | ppm/°C | 19-24 | ppm/°C | 19-24 |
| z CTE | ASTM D 3386 (TMA) | ppm/°C | 64 | ppm/°C | 64 |
| Flammability | UL-94 | | V-0 | | V-0 |
| Hardness | Rockwell M Scale | | 34 | | 34 |
Benefits
The RF-35 PCB delivers numerous advantages:
Cost-Effective: Ideal for high-volume applications without compromising quality.
Excellent Peel Strength: Superior adhesion facilitates easier rework and assembly.
Low Moisture Absorption: Ensures reliable performance in humid conditions.
Enhanced Surface Smoothness: Improves performance in high-frequency applications.
PCB Stackup Configuration
This PCB features a 2-layer rigid stackup:
Copper Layer 1: 35 μm
RF-35 Core: 1.524 mm (60 mil)
Copper Layer 2: 35 μm
This configuration results in a finished board thickness of 1.6 mm, with a total copper weight of 1 oz (1.4 mils) on the outer layers.
Construction Details
Board Dimensions: 45.9 mm x 30.5 mm (±0.15 mm)
Minimum Trace/Space: 5/5 mils
Minimum Hole Size: 0.3 mm
No Blind Vias included in the design.
Via Plating Thickness: 25 μm
Surface Finish: HASL (Hot Air Solder Leveling) for reliable solderability.
Silkscreen and Solder Mask: Features a white top silkscreen; no bottom silkscreen or solder mask.
Each PCB undergoes a comprehensive 100% electrical test prior to shipment, ensuring top-notch reliability and performance.
Quality Assurance
This PCB adheres to the IPC-Class-2 quality standard, ensuring high reliability suitable for a variety of applications.
Applications
The RF-35 PCB is well-suited for a range of applications, including:
Power Amplifiers: Optimized for efficient signal amplification.
Filters and Couplers: Designed for effective signal processing.
Passive Components: Ideal for various passive RF components.
Availability
This PCB is available worldwide, making it an excellent choice for engineers and designers seeking high-performance, cost-effective solutions for RF applications.
| PCB Material: | PTFE Ceramic Fiberglass |
| Designation: | RF-35 |
| Dielectric constant: | 3.5 |
| Dissipation Factor | 0.0018 |
| Layer count: | Double Layer, Multilayer, Hybrid PCB |
| Copper weight: | 0.5oz (17 µm), 1oz (35µm), 2oz (70µm) |
| Laminate thickness: | 10mil (0.254mm), 20mil (0.508mm), 30mil (0.762mm), 60mil (1.524mm) |
| PCB size: | ≤400mm X 500mm |
| Solder mask: | Green, Black, Blue, Yellow, Red etc. |
| Surface finish: | Bare copper, HASL, ENIG, Immersion silver, Immersoin tin, OSP etc.. |
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60mil RF-35 Radio Frequency Pcb Double Sided HASL White Silkscreen Images
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