Introducing a high-performance Rogers RO3010 PCB, designed for advanced applications requiring exceptional electrical and mechanical stability. This 2-layer rigid PCB leverages the superior properties of Rogers RO3010, a ceramic-filled PTFE composite that offers a high dielectric constant and outstanding reliability across a wide frequency range. Ideal for circuit miniaturization, this PCB is perfect for engineers looking to enhance their designs while maintaining cost-effectiveness.
Key Features
- High Dielectric Constant: 10.2 ± 0.30 at 10 GHz/23°C, ensuring effective signal integrity.
- Low Dissipation Factor: 0.0022 at 10 GHz/23°C, minimizing signal loss.
- Thermal Stability: -55 to 288 °C, with a low Coefficient of Thermal Expansion of 13 ppm/°C (X), 11 ppm/°C (Y), and 16 ppm/°C (Z).
- High Thermal Stability: Td > 500°C, supporting high-temperature applications.
- Excellent Thermal Conductivity: 0.95 W/mK for efficient heat dissipation.
- Minimal Moisture Absorption: 0.05%, enhancing reliability in diverse environments.
- Wide Operating Range: Suitable for -40℃ to +85℃ environments.
| RO3010 Typical Value |
| Property | RO3010 | Direction | Units | Condition | Test Method |
| Dielectric Constant,εProcess | 10.2±0.05 | Z | | 10 GHz/23℃ | IPC-TM-650 2.5.5.5 Clamped Stripline |
| Dielectric Constant,εDesign | 11.2 | Z | | 8GHz to 40 GHz | Differential Phase Length Method |
| Dissipation Factor,tanδ | 0.0022 | Z | | 10 GHz/23℃ | IPC-TM-650 2.5.5.5 |
| Thermal Coefficient of ε | -395 | Z | ppm/℃ | 10 GHz -50℃to 150℃ | IPC-TM-650 2.5.5.5 |
| Dimensional Stability | 0.35
0.31 | X
Y | mm/m | COND A | IPC-TM-650 2.2.4 |
| Volume Resistivity | 105 | | MΩ.cm | COND A | IPC 2.5.17.1 |
| Surface Resistivity | 105 | | MΩ | COND A | IPC 2.5.17.1 |
| Tensile Modulus | 1902
1934 | X
Y | MPa | 23℃ | ASTM D 638 |
| Moisture Absorption | 0.05 | | % | D48/50 | IPC-TM-650 2.6.2.1 |
| Specific Heat | 0.8 | | j/g/k | | Calculated |
| Thermal Conductivity | 0.95 | | W/M/K | 50℃ | ASTM D 5470 |
Coefficient of Thermal Expansion
(-55 to 288℃) | 13
11
16 | X
Y
Z | ppm/℃ | 23℃/50% RH | IPC-TM-650 2.4.4.1 |
| Td | 500 | | ℃ TGA | | ASTM D 3850 |
| Density | 2.8 | | gm/cm3 | 23℃ | ASTM D 792 |
| Copper Peel Stength | 9.4 | | Ib/in. | 1oz,EDC After Solder Float | IPC-TM 2.4.8 |
| Flammability | V-0 | | | | UL 94 |
| Lead-free Process Compatible | Yes | | | | |
Benefits
- Dimensional Stability: Material expansion is closely matched to copper, ensuring reliability in multi-layer designs.
- Cost-Effective Manufacturing: Economical laminate pricing supports high-volume production.
- Versatile Applications: Suitable for a variety of applications, from automotive radar to telecommunications.
PCB Specifications
This PCB with dimensions of 60.8 mm x 35.4 mm. It is constructed as a 2-layer rigid PCB, incorporating a 10 mil (0.254 mm) Rogers RO3010 substrate between two layers of 35 μm copper. The finished board thickness is 0.32 mm, with a copper weight of 1 oz (1.4 mils) on the outer layers. The board is designed without silkscreen or solder mask, and it utilizes a laser-cut profile for its contour.
Artwork and Standards
This PCB is supplied with artwork in the Gerber RS-274-X format, complying with the IPC-Class-2 standard. This adherence to industry standards guarantees a high-quality product that meets the demands of professional applications.
Availability
Our Rogers RO3010 PCBs are available for worldwide shipping, ensuring that engineers and designers can access this advanced technology no matter their location. This global availability supports a wide range of projects and applications.
Typical Applications
-Automotive radar systems
-Global positioning satellite antennas
-Cellular telecommunications (power amplifiers and antennas)
-Wireless communication patch antennas
-Direct broadcast satellites
-Datalink systems for cable networks
-Remote meter reading systems
-Power backplanes
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