In the fast-evolving landscape of electronics, the demand for high-performance printed circuit boards (PCBs) is at an all-time high. Our newly shipped 2-layer PCB, constructed from Rogers RO3003 material, stands at the forefront of this technology, specifically designed for applications that require reliability, precision, and high-frequency performance. This article delves into the intricacies of our latest offering, outlining its construction, benefits, applications, and the unique advantages that set it apart in the competitive market.
PCB Construction and Specifications
Material and Layering
The foundation of this PCB lies in the use of Rogers RO3003, a ceramic-filled PTFE composite renowned for its stability and performance in high-frequency applications. The board features a 2-layer rigid design, measuring 69.25 mm x 92.45 mm, making it compact yet powerful enough to meet diverse application needs.
The stackup of the PCB is as follows:
- Copper Layer 1: 35 μm
- Rogers RO3003 Substrate: 5 mil (0.127 mm)
- Copper Layer 2: 35 μm
Precision Specifications
This PCB is engineered with high precision, offering:
- Minimum Trace/Space: 5/5 mils
- Minimum Hole Size: 0.2 mm
- Finished Board Thickness: 0.2 mm
- Finished Copper Weight: 1 oz (1.4 mils) on the outer layers
- Via Plating Thickness: 20 μm
- Surface Finish: Immersion Gold
With 100% electrical testing prior to shipment, we ensure that every board meets stringent quality standards, ready to perform reliably in the field.
Advantages of Rogers RO3003 Material
Stability and Performance
One of the defining features of Rogers RO3003 is its excellent stability of dielectric constant (Dk) over a range of temperatures and frequencies.
This characteristic is crucial for applications that demand consistent performance, such as automotive radar systems operating at 77 GHz and advanced wireless communication technologies, including 5G infrastructure.
- Dielectric Constant: 3 ± 0.04 at 10 GHz/23°C
- Dissipation Factor: 0.001 at 10 GHz/23°C
- Thermal Stability: Td > 500°C
- Moisture Absorption: 0.04%
These properties make RO3003 an ideal choice for applications that require low dielectric loss and excellent mechanical properties across varying temperatures.
| RO3003 Typical Value |
| Property | RO3003 | Direction | Units | Condition | Test Method |
| Dielectric Constant,εProcess | 3.0±0.04 | Z | | 10 GHz/23℃ | IPC-TM-650 2.5.5.5 Clamped Stripline |
| Dielectric Constant,εDesign | 3 | Z | | 8GHz to 40 GHz | Differential Phase Length Method |
| Dissipation Factor,tanδ | 0.001 | Z | | 10 GHz/23℃ | IPC-TM-650 2.5.5.5 |
| Thermal Coefficient of ε | -3 | Z | ppm/℃ | 10 GHz -50℃to 150℃ | IPC-TM-650 2.5.5.5 |
| Dimensional Stability | 0.06
0.07 | X
Y | mm/m | COND A | IPC-TM-650 2.2.4 |
| Volume Resistivity | 107 | | MΩ.cm | COND A | IPC 2.5.17.1 |
| Surface Resistivity | 107 | | MΩ | COND A | IPC 2.5.17.1 |
| Tensile Modulus | 930
823 | X
Y | MPa | 23℃ | ASTM D 638 |
| Moisture Absorption | 0.04 | | % | D48/50 | IPC-TM-650 2.6.2.1 |
| Specific Heat | 0.9 | | j/g/k | | Calculated |
| Thermal Conductivity | 0.5 | | W/M/K | 50℃ | ASTM D 5470 |
Coefficient of Thermal Expansion
(-55 to 288℃) | 17
16
25 | X
Y
Z | ppm/℃ | 23℃/50% RH | IPC-TM-650 2.4.4.1 |
| Td | 500 | | ℃ TGA | | ASTM D 3850 |
| Density | 2.1 | | gm/cm3 | 23℃ | ASTM D 792 |
| Copper Peel Stength | 12.7 | | Ib/in. | 1oz,EDC After Solder Float | IPC-TM 2.4.8 |
| Flammability | V-0 | | | | UL 94 |
| Lead-free Process Compatible | Yes | | | | |
Mechanical Properties
This PCB features a low coefficient of thermal expansion (CTE), which closely matches that of copper. This alignment allows for more reliable surface-mounted assemblies, making it suitable for applications sensitive to temperature fluctuations. The uniform mechanical properties across a range of dielectric constants also facilitate multi-layer board designs, enhancing versatility in circuit design.
Applications
Our 2-layer RO3003 PCB is designed to excel in several key applications:
- Automotive Radar: For systems that necessitate high-frequency operation for safety and navigation.
- Telecommunications: Power amplifiers and antennas in cellular systems benefit from the low-loss characteristics of this PCB.
- Satellite Communications: Its performance is critical for GPS antennas and direct broadcast satellites, ensuring reliable data transmission.
- Wireless Communication: Ideal for patch antennas and remote meter readers.
Global Availability
This advanced PCB is available for worldwide shipping, adhering to IPC-Class-2 standards, which guarantees that it meets the quality and reliability expected in various industrial applications. Our commitment to excellence ensures that you receive a product that not only meets but exceeds your expectations.
Conclusion
In summary, our newly shipped 2-layer PCB made from Rogers RO3003 is more than just a circuit board; it is a powerful tool designed to meet the challenges of modern electronics. With its superior material properties, precision engineering, and extensive application potential, this PCB is poised to support the next generation of high-frequency technologies.
Choose our RO3003 PCB for your next project and experience the difference that high-quality materials and craftsmanship can make. For more information or to place an order, contact us today and let us help you achieve your goals.
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